ISE Labs, Inc.

Optical Microscopy

Optical microscopy: inspection of samples at magnification, locating ESD damage on die, solder ball inspection, viewing surface damage. Bright and dark field with digital capture.
Example

X-ray Imaging

X-Ray Radiography is a nondestructive failure analysis technique used to examine the interior details of a device. X-Ray radiography is commonly used to inspect for wire sweep and other wire bond problems, die attach voids, package voids and cracks. It is excellent for determining lead frame outlines as well.
Example

Cross Section

Cross-sectioning or micro sectioning is a failure analysis technique for mechanically exposing a plane of interest in a die or package for further analysis or inspection. It usually consists of sawing, grinding, polishing, and staining the specimen until the plane of interest is ready for inspection by optical or electron microscopy.
Example

De-capsulation

Decapsulation is a failure analysis step performed to open a plastic package for internal examination. If the package being opened is hermetic, then the process is referred to as 'delidding' or 'decapping.' Delidding/decapping is a purely mechanical process. It may refer to the prying of the combo lid off a ceramic package, or the application of opposite torques to the top and bottom parts of the ceramic DIP to break the seal glass, or the cutting of the weld around a metal can.
Example

Field Emission Scanning Electron Microscopy (FE-S.E.M)

Scanning electron microscopy is used for inspecting specimens at very high magnifications. We have a Hitachi 4800 capable of magnification up to 600,000 x.
Example

Energy Dispersive X-ray (EDX)

In the SEM process X-rays are generated. The X-ray energy corresponds to the elements in the sample. These X-rays may be detected and analyzed to determine the elements present and their concentrations in the areas scanned. Elemental maps may also be created showing the location of the elements in the region analyzed.
Example

Scanning Acoustic Microscopy (C-SAM)

Scanning Acoustic Microscopy (SAM) is a failure analysis technique used for detecting delaminations between package interfaces. The sound wave is generated by a piezoelectric crystal, or transducer that has been cut to provide a specific frequency. The wave travels through the specimen's material at the velocity of sound, with a portion of it being reflected back every time it hits an interface within the material.
Failure Mechanisms/Attributes Tested For: Plastic-to-Leadframe Delamination, Plastic-to-Die Delamination, Plastic-to-Die Attach Delamination, Die Attach Voids, Internal Cracks, etc. Internal delaminations generally need to be addressed (especially those that occur on the die surface and bonding fingers) because they can lead to serious reliability issues such as neck breaks, heel breaks, and corrosion.
Example

Additional techniques available through ISE’s FA lab

SIMS Secondary Ion Mass Spectroscopy - Request Form
ESCA Electron Spectroscopy for Chemical Analysis
AES Auger Electron Spectroscopy
TEM Transmission Electron Microscopy


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