Home > Services > Turnkey > Total Assembly / Package Services

We have the expertise and experience to offer a full range of packaging services to optimize the device thermal and electrical performance. Working closely with our customers we can deliver first pass optimized packaging solutions. Services include the following:

1. Package Design & Assembly
2. Package selection, substrate design
3. Substrate / lead frame order for customer
4. Thermal, electrical & stress simulation
5. IC package assembly