Temperature
Cycling Test(TCT, Air to Air)
Temperature Cycle Testing (TCT) determines
the ability of parts to resist extremely low and extremely
high temperatures, as well as their ability to withstand cyclical
exposures to these temperature extremes.Failure(fatigue failure)
mechanisms accelerated by temperature cycling include die cracking,
package cracking, neck/heel/wire breaks, and bond lifting.
Power
and Temperature Cycling(PTC)
This Power and Temperature Cycling Test
is performed to determine the ability of a device to withstand alternate
exposures at high and low temperature extremes with
operating biases periodically applied and removed. It is
intended to simulate worst-case conditions encountered in typical
applications. This test method is considered destructive, and is
intended primarily for device qualification.
Thermal
Shock Test( Liquid to Liquid)
Thermal Shock is performed to determine
the resistance of the part to sudden changes in temperature. The
parts undergo a specified number of cycles, which start at ambient
temperature. The parts are then exposed to an extremely low (or
high) temperature and, within a short period of time, exposed
to an extremely high (or low) temperature, before going back
to ambient temperature. Failure mechanisms accelerated by thermal
shock include die cracking, package cracking, neck/heel/wire breaks,
and bond lifting
Autoclave(Pressure
Pot)/Moisture Resistance
The autoclave Test, also known as a Pressure
Cooker Test (PCT), or a Pressure Pot Test (PPOT), is a reliability
test performed to assess the ability of a product to withstand severe
temperature and humidity conditions. It is used primarily
to accelerate corrosion in the metal parts of the product, including
the metallization areas on the surface of the die. It also subjects
the samples to the high vapor pressure generated inside the
autoclave chamber. Autoclave testing consists of soaking the samples
for 168 hours at 121șC, 100% RH, and 29.7psia/205kPa. This
test is used to identify failure mechanisms internal to the package
and is destructive.
Salt
Atmosphere
The Salt Atmosphere test is conducted to
determine the resistance of solid state device to corrosion
and considered destructive. It is an accelerated test that simulates
the effect of severe salt atmosphere exposure.
High
Temperature Storage(HTS)
HTS test is performed to determine the effect
on devices of long-term storage at elevated temperatures
without any electrical stresses applied. HTS is effective for the
reliability testing of samples in terms of mechanisms accelerated
by temperature only, e.g., oxidation, bond and lead finish intermetallic
growths, etc. Summary of industry-standard HTS conditions: 1000
hours @150șC.
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