Radiograph (X-ray) X-Ray Radiography is a nondestructive semiconductor failure analysis technique used to examine the interior details of the package. X-Ray radiography is commonly used to inspect for wiresweeping and other wirebond problems, die attach voids, package voids and cracks. It is excellent for determining leadframe outlines as well.

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Cross Section

Cross-sectioning or microsectioning is a failure analysis technique for mechanically exposing a plane of interest in a die or package for further analysis or inspection. It usually consists of sawing, grinding, polishing, and staining the specimen until the plane of interest is ready for optical or electron microscopy.

De-capsulation

Decapsulation is a failure analysis step performed to open a plastic package for internal examination. If the package being opened is hermetic, then the process is referred to as 'delidding' or 'decapping.' The techniques used for decapsulation are very different from those of delidding and decapping. Delidding/decapping is a purely mechanical process. It may refer to the prying of the combo lid off a ceramic package, or the application of opposite torques to the top and bottom parts of the ceramic DIP to break the seal glass, or the cutting of the weld around a metal can.

Scanning Electron Microscopy (S.E.M)

Scanning electron microscopy is used for inspecting topographies of specimens at very high magnifications using a piece of equipment called the scanning electron microscope. SEM magnifications can go to up to 200,000 X. SEM inspection is often used in the analysis of Die/Package Cracks, Die Attach Failures/Defects, Bonding Failures/Defects, Wire Defects/Fractures, Lead Defects/Failures, Foreign Materials on Die/Package, Die Surface Defects, Seal Cracks/Defects, etc. on the die or package surface.

Code Scanning Acoustic Microscopy (C-SAM)

Scanning Acoustic Microscopy (SAM) is a failure analysis technique used for detecting disbonds or delaminations between package interfaces. It basically consists of sending a sound wave through the package, and interpreting the interaction of the sound wave with the package. The sound wave may be generated by a piezoelectric crystal, or transducer, that has been cut to provide a specific frequency. This wave travels to the specimen through a medium or couplant, which is usually deionized water since sound waves could not travel through air at the frequencies used. The wave travels through the specimen's material at the material's velocity, with a portion of it being reflected back every time it hits an interface within the material.   Failure Mechanisms/Attributes Tested For: Plastic-to-Leadframe Delamination, Plastic-to-Die Delamination, Plastic-to-Die Attach Delamination, Die Attach Voids, Internal Cracks, etc. Internal delaminations generally need to be addressed (especially those that occur on the die surface and bonding fingers) because they can lead to serious reliability issues such as neck breaks, heel breaks, and corrosion.  

#	Test	System
1	HAST (High Accerated Stress Test)	HIRAYAMA PC422R7, EXPRESS TEST600X
2	Temperature Cycling (Air to Air)	RANSCO 7108-2, BLUE M WSP 109BMP3
3	Thermal Shock (Liquid to Liquid)	BLUE M LTB-ATS-2
4	THB 85/85 (Temperature Humidity Bias)	ESPEC PRA-4AP, ESPEC PXA-3AP
5	Moisture Resistance	ESPEC LHL112
6	IR Reflow, Infra Red Solder Reflow	HELLER 688 HAC
7	Centrifuge Test (Constant Acceleration)	CENTRISAFE G-385-4E
8	HTS (High Temperature Storage)	SES TB/2C
9	Gross and Fine Leak Detection	INTERTEST 1014-C
10	Physical Dimensions	NIKON V-12
11	PIND Test	PTI 4501M
12	Package Decapsulation	CAPT AIR 5000C
13	Wire Bond Pull and Ball Shear	DAGE 4000
14	Capacitance & Resistance Measurement	HP 4284A
15	Mechanical Shock Test	AVEX MP
16	Vibration Test	LDS
17	C-SAM	SONIX HS1000, Sonoscan D9000C
18	X-Ray	XTEC X-TEKVTX-16KV
19	SEM (Scanning Electron Microscopy)	EDAX S-2500CI
20	XRF (X-Ray Fluorescence)	TWINTEST CUPS
21	Laser Lead Scan	IS 3900DB, ICOS CI-8450
22	ESD and Latch-Up	MK2, PARAGON, KEYTEC-ZAP MASTER
23	CDM	RCDM VERIFIER
24	979 Fine Leak Detector(Helium)	Varian

C-Sam Imaging Modes (C-SAM)

Sonoscan - Sound Technology with Vision