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 Vibration Test
To determine the ability of component(s)
to withstand moderate to severe vibration as a result of motion
produced by transportation or filed operation of electrical equipment.
Mechanical Shock Test
To determine the suitability of component
parts for use in electronic equipment that may be subjected to moderately
severe shocks as a result of suddenly applied forces or abrupt
changes in motion produced by rough handling, transportation, or field
operation. Shock of this type may disturb operating characteristics, particularly
if the shock pulses are repetitive. It is normally applicable to cavity-type
packages.
Gross/Fine
Leak Test
To determine the effectiveness of
the seal hermetically sealed solid-state devices. Fine and gross
leak tests shall be conducted in accordance with the requirements
and procedures of the specified test condition. Testing order shall
be fine leak, followed by gross leak. Where bomb pressure
specified exceeds the device capability, alternative pressure,
exposure time and dwell time conditions may be used provided
they satisfy the leak rate, pressure, time relationships which apply,
and provided no less than 30 psia bomb pressure is applied in any
case. A definite stream of bubbles or two or more large bubbles
originating from the same point shall be cause for rejection.
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Physical Dimensions
To verify the external physical dimensions
of the device meet the requirements.
Lid Torque
To determine the shear strength of
the seal of glass-frit-sealed packages.
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Solderability Test
The purpose of this test is to provide a
means of determining the solderability of device package
terminations that are intended to be joined to another surface using
solder for the attachment.
Marking Permanency
To verify the markings will not become illegible when the part is subjected to solvents.
Flammability Test
Flammability test is indication of a plastics
acceptability for use as part of a device or appliance with
respect to its flammability. It is not intended to reflect the hazards
of a material under actual fire conditions.
Centrifuge Test
To determine the effects of constant
acceleration on microelectronic devices.
Particle Impact Noise Detection (PIND)
To detect loose particles inside
a device cavity. Normally use this test after constant acceleration.
Wire
Bond Shear/Pull, Bond Pull, Bond Shear, Die Shear, Ball Shear
To determine the integrity and measure
the strength of microelectronic device by a mechanical force.
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