- Photography and Optical Microscopy
- Non-destructive visual inspection of the sample
- Radiography Inspection (X-Ray)
- Non-destructive analysis to exam the interior of a device, including 3D capability
- Cross-Section
- Destructive internal mechanical exposure of a die or package
- Decapsulation
- Destructive process performed to expose internal package for examination, including copper bond wire
- Scanning Electron Microscopy (SEM)
- Surface inspection of specimens at high magnifications (up to 600,000x)
- Energy Dispersive Spectroscopy (EDS/EDX)
- Analysis to determine the elemental composition of an external target area
- Scanning Acoustic Microscopy
- Non-destructive internal package inspection to detect anomalies delamination
- Emission Microscope (EMMI)
- Dye & Pry
- Red dye under pressure penetrates cracks and delaminations in solder balls. Pry to separate device from PCB and examine optically. Also used for crack/ingress identification in cross sections and parallel lapping
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