- Vibration Test
- Ability of components to withstand vibration as a result of motion or transportation
- Mechanical Shock Test
- Suitability of components that may be subjected to defined g-forces
- Gross/Fine Leak
- Checks for leaks on hermetically sealed devices
- Lid Torque
- Determines the shear strength of sealed device packages
- Solderability Test
- Determines solderability of device package terminations that are intended for attachments
- Marking Permanency
- Ensures markings sustain the application of solvents
- Centrifuge (Constant Acceleration)
- Determines the effects of constant acceleration on devices with designed internal cavities
- Wire Bond Shear/Bond Pull
- Measures integrity and strength of microelectronic device by applying mechanical force
- Destructive Physical Analysis (DPA)
- Examination of post test to ensure there is no evidence of defects or damage resulting from prior testing
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